Remote Plasma Wafer System
Remote plasma will help you generate new products and coatings
You're much more likely to achieve innovative material properties with our remote plasma technology!
Features
- Utilises Plasma Quest's ' Remote Plasma Source'; remotely generated plasma means new coatings are achievable
- Multi-target / multi-layer deposition achievable within a single chamber
- High Target Utilisation – reducing waste and cost while improving coating quality and uniformity
- Uniform Target Erosion - no “race track” - stable high rate reactive process, no feedback required, cheaper and simpler process
- Facilitates Low Temperature Deposition - deposition onto plastic or other ‘delicate’ substrates
- Conformal coverage of uneven surfaces – with substrate bias option
Specifications
- Up to 6" targets
- Multiple target assembly
- Can accommodate up to 8″ diameter substrates
- Uniformity better than +/- 1% over 18 cm diameter (data from metallic deposition)
- Overnight base pressure < 1.0 x 10-6 mbar (UHV option available)
- Process pressure range: 8.0 x 10-4 to 2.0 x 10-2 mbar
- Up to 4 MFCs gas inlet channels with isolation valves
- Up to 5 kW plasma power with remote plasma modified matching unit
- Up to 5 KW target power pDC (RF option available)
All specifications can be customised – please contact us
Ordering Information
SKU |
Description |
Price |
C600 |
150mm Wafer HiTUS System |
POA |
C600SB |
150mm Wafer HiTUS System with substrate bias |
POA |