Remote Plasma Wafer System

Remote plasma will help you generate new products and coatings

You're much more likely to achieve innovative material properties with our remote plasma technology!


Features

  • Utilises Plasma Quest's ' Remote Plasma Source'; remotely generated plasma means new coatings are achievable
  • Multi-target / multi-layer deposition achievable within a single chamber
  • High Target Utilisation – reducing waste and cost while improving coating quality and uniformity
  • Uniform Target Erosion - no “race track” - stable high rate reactive process, no feedback required, cheaper and simpler process
  • Facilitates Low Temperature Deposition - deposition onto plastic or other ‘delicate’ substrates
  • Conformal coverage of uneven surfaces – with substrate bias option

Specifications


  • Up to 6" targets
  • Multiple target assembly
  • Can accommodate up to 8″ diameter substrates
  • Uniformity better than +/- 1% over 18 cm diameter (data from metallic deposition)
  • Overnight base pressure < 1.0 x 10-6 mbar (UHV option available)
  • Process pressure range: 8.0 x 10-4 to 2.0 x 10-2 mbar
  • Up to 4 MFCs gas inlet channels with isolation valves
  • Up to 5 kW plasma power with remote plasma modified matching unit
  • Up to 5 KW target power pDC (RF option available)


All specifications can be customised – please contact us


Ordering Information

SKU

Description

Price

C600

150mm Wafer HiTUS System

POA

C600SB

150mm Wafer HiTUS System with substrate bias

POA