About us
Plasma Quest provides thin film materials and process solutions that cannot be met by current deposition technologies. Plasma Quest can be contracted, under confidentiality agreement, to undertake design services and thin film materials process development.
Access to Plasma Quest’s thin film deposition expertise can improve time to market and reduce internal costs while minimising risk by effectively extending the capability of your own R&D resource.
Our primary focus is on using our own technology for the deposition of high quality thin film materials in a variety of applications.
- Contract R&D – from ‘proving’ trials to full scale process development and production trials
- Full Remote Plasma System design and build / retrofit service
- System commissioning, process consultancy and training
Discover more...
If you would like to discuss your trial requirements, obtain costing, turnaround times, or for any other enquiries,
we would love to hear from you.
Plasma Quest's Differentiators...
- Wide Range of Materials
- Metals, magnetic materials, TCOs, dielectrics, polymers
- Remotely Generated Plasma
- We have independent control of all process parameters including to give us a large parameter space due to to independent control of target voltage and ion current.
- Low Temperature Process
- Low temperature deposition for polymeric and other ‘delicate’ substrates
- Stable High Rate Reactive Process
- Virtual elimination of target poisoning as the surface of the target is uniformly eroded
- Stress Control
- Due to our unique process we are able to control the stress of growing thin films from compressive through to tensile
- High Target Utilisation
- Reducing costs and reducing waste
- High adhesion of coating
- Plasma assist improve adhesion, eliminating the need for adhesion promoting layers (tie layers)
- Ionised Physical Vapour Deposition
- The high density plasma can ionise a significant fraction of the sputter flux. In conjunction with an electrically biased substrate it can influence the directionality and energy of the arriving ionised material.
- Thick ferromagnetic targets
- Ability to sputter from thick ferromagnetic targets
- Substrate plasma-treatment
- Offering enhanced adhesion performance