Conformal Coverage

We can use substrate bias to conformally coat surfaces with complex topographies



The high density plasma continuously ionises the sputter flux

Remote plasma sputtering is inherently an iPVD (ionised physical vapour deposition) process


We have experience in:


  • Conformal coating of trenches
  • Selective side wall coverage
  • Coating features not in direct line of site to the target
  • Conformally coating non-conducting substrates
  • Deposition of seed layers for electro-plating


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